The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Feb. 03, 2019
Applicant:
Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong, CN;
Inventors:
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H02M 1/14 (2006.01); H02M 1/34 (2007.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H02M 1/14 (2013.01); H02M 1/34 (2013.01); H05K 1/0204 (2013.01); H05K 1/028 (2013.01); H05K 1/14 (2013.01); H05K 1/181 (2013.01); H05K 7/1427 (2013.01); H02M 2001/344 (2013.01); H05K 2201/047 (2013.01); H05K 2201/10053 (2013.01); H05K 2201/10545 (2013.01);
Abstract
Example embodiment is a power converter that adopt a 3D structure to increase the power density and improve thermal performance. The power converter includes a bottom substrate and at least one side substrate. Both the bottom substrate and the side substrate are rigid. Each side substrate is connected with the bottom substrate by a flexible substrate and forms an angle with the bottom substrate. The bottom substrate is further electrically connected with a plurality of surface mounting devices which are rigid. The flexible substrate provides electrical connection between the bottom substrate and the side substrate.