The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Jun. 26, 2018
Applicant:

Adata Technology Co., Ltd., New Taipei, TW;

Inventors:

Yung-Hsing Yin, New Taipei, TW;

Jen-Chieh Pan, New Taipei, TW;

Assignee:

ADATA TECHNOLOGY CO., LTD., New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/02 (2006.01); H05K 7/20 (2006.01); H05K 9/00 (2006.01); G11C 5/04 (2006.01); G11C 11/34 (2006.01); G11C 7/04 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20409 (2013.01); G11C 5/04 (2013.01); G11C 7/04 (2013.01); G11C 11/34 (2013.01); H05K 9/0071 (2013.01);
Abstract

A storage module structure of a storage assembly includes an upper shielding component, a lower shielding component and a memory component. An outer surface of the upper shielding component has a plurality of heat-conducting units. The lower shielding component is located above the upper shielding component, and an accommodating space is defined between the upper shielding component and the lower shielding component. The memory component is located in the accommodating space. The heat-conducting units contact an external structure, and a thermal energy generated by the memory component is conducted to the external structure through the plurality of heat-conducting units.


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