The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Jul. 05, 2018
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventor:

Keito Yonemori, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H02M 3/155 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H02M 3/155 (2013.01); H05K 1/111 (2013.01); H05K 1/144 (2013.01); H05K 1/147 (2013.01); H05K 1/165 (2013.01); H05K 1/181 (2013.01); H05K 1/028 (2013.01); H05K 1/114 (2013.01); H05K 1/142 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10037 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10734 (2013.01);
Abstract

An electronic component module includes a substrate, a coil element provided in or on the substrate, and an IC element connected to the coil element, in which external terminals are provided on the substrate, the substrate includes a first region and a second region different region from the first region when the substrate is viewed in plan view, the IC element is provided in the first region, the external terminals are provided at least in the first region, the coil element extends across the first region and the second region, and the first region is a rigid region and the second region is more flexible than the first region.


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