The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

May. 11, 2017
Applicant:

Ushio Denki Kabushiki Kaisha, Tokyo, JP;

Inventors:

Akihisa Nagano, Tokyo, JP;

Daiki Yamatani, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05G 2/00 (2006.01); G03F 7/20 (2006.01); H05H 1/24 (2006.01);
U.S. Cl.
CPC ...
H05G 2/00 (2013.01); G03F 7/70033 (2013.01); H05G 2/006 (2013.01); H05H 1/24 (2013.01); H05G 2/001 (2013.01); H05G 2/003 (2013.01); H05G 2/005 (2013.01);
Abstract

Disclosed herein a high temperature plasma raw material supply apparatus capable of appropriately supplying high temperature plasma raw materials in which impurities are suppressed to a reservoir reserving high temperature plasma raw material in a liquid state. A tin filling mechanism includes a raw material reservoir unit rotatably arranged and configured to reserve a plurality of high temperature plasma raw materials in a solid state; a supply nozzle configured to supply the high temperature plasma raw materials to an outside of the raw material reservoir unit; a load lock unit provided between a housing and a chamber; and a supply path unit configured to guide the high temperature plasma raw materials supplied from the supply nozzle to the load lock unit. At least a part of the supply path unit is provided with a hole formed smaller than the high temperature plasma raw material in the solid state.


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