The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Nov. 06, 2018
Applicant:

Nichia Corporation, Anan-shi, JP;

Inventor:

Ryoji Naka, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/486 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/181 (2013.01);
Abstract

A package includes a resin molded body having a side wall provided between a first side and a second side to surround a recess portion which has a bottom portion on the second side. The bottom portion of the recess portion includes an element mount region provided in a vicinity of the side wall and a wire connection region separated from the element mount region. The element mount region has a polygonal outer peripheral shape having corners and diagonals connecting two of the corners when viewed in the height direction. An area of the wire connection region is smaller than an area of the element mount region when viewed in the height direction. The wire connection region is provided on an extension of one of the diagonals passing through one of the corners of the element mount region to face toward the adjacent to one of the corners.


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