The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Aug. 21, 2018
Applicants:
Boe Technology Group Co., Ltd., Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;
Inventors:
Assignees:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G09G 3/20 (2006.01); H01L 27/32 (2006.01); G02F 1/1362 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 27/124 (2013.01); G02F 1/1362 (2013.01); G09G 3/20 (2013.01); H01L 27/1262 (2013.01); H01L 27/3258 (2013.01); G02F 2001/136254 (2013.01); H01L 51/5237 (2013.01);
Abstract
A method for manufacturing an array substrate, including forming at least two data lines, forming a buffer layer on the data lines, forming an organic film, which is provided with vias, on the buffer layer, the vias being in a partially overlapping relationship with the orthographic projection of the two adjacent data lines on a base substrate, forming a first conductive layer on the organic film.