The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jul. 26, 2018
Applicant:
Lumens Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Assignee:
LUMENS CO., LTD., Yongin-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 33/36 (2010.01); H01L 25/075 (2006.01); H01L 27/15 (2006.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01L 25/0753 (2013.01); H01L 27/156 (2013.01); H01L 33/36 (2013.01); H01L 33/382 (2013.01); H01L 33/62 (2013.01); H01L 27/124 (2013.01); H01L 27/1218 (2013.01); H01L 2933/0066 (2013.01);
Abstract
Micro-LED array display devices are disclosed. One of the micro-LED display devices includes: a micro-LED panel including a plurality of micro-LED pixels; a CMOS backplane including a plurality of CMOS cells corresponding to the micro-LED pixels to individually drive the micro-LED pixels; and bumps electrically connecting the micro-LED pixels to the corresponding CMOS cells in a state in which the micro-LED pixels are arranged to face the CMOS cells. The micro-LED pixels are flip-chip bonded to the corresponding CMOS cells formed on the CMOS backplane through the bumps so that the micro-LED pixels are individually controlled.