The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Nov. 25, 2016
Applicant:
Omron Corporation, Kyoto, JP;
Inventors:
Wakahiro Kawai, Konan, JP;
Kazuyuki Otake, Tsurugashima, JP;
Assignee:
OMRON Corporation, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/54 (2010.01); H01L 25/075 (2006.01); F21V 8/00 (2006.01); H01L 33/00 (2010.01); H01L 33/36 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); G02B 6/0073 (2013.01); G02B 6/0083 (2013.01); H01L 33/0079 (2013.01); H01L 33/36 (2013.01); H01L 33/54 (2013.01); H01L 33/62 (2013.01); G02B 6/009 (2013.01); G02B 6/0068 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 51/5206 (2013.01); H01L 51/5221 (2013.01); H01L 51/5253 (2013.01); H01L 51/56 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/96 (2013.01); H01L 2924/18162 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0066 (2013.01);
Abstract
In order to be more compact and thin, this light emitting device includes LED elements embedded in a resin molded body such that light emitting units are exposed on a lateral surface of the resin molded body and positive electrodes and negative electrodes are exposed on a back surface which is perpendicular to the lateral surface of the resin molded body.