The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jul. 28, 2017
Applicant:
Stora Enso Oyj, Helsinki, FI;
Inventor:
Juha Maijala, Espoo, FI;
Assignee:
STORA ENSO OYJ, Helsinki, FI;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H05K 1/02 (2006.01); H05K 3/30 (2006.01); H01L 23/498 (2006.01); A61J 1/03 (2006.01); B65D 25/00 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 23/64 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); A61J 1/035 (2013.01); B65D 25/00 (2013.01); H01L 23/4985 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 23/642 (2013.01); H01L 23/645 (2013.01); H05K 1/028 (2013.01); H05K 1/0239 (2013.01); H05K 1/0275 (2013.01); H05K 1/0292 (2013.01); H05K 3/301 (2013.01); A61J 2200/30 (2013.01); A61J 2205/60 (2013.01); B65D 2203/10 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0216 (2013.01); H05K 1/111 (2013.01); H05K 1/165 (2013.01); H05K 3/0052 (2013.01); H05K 3/303 (2013.01); H05K 3/305 (2013.01); H05K 2201/053 (2013.01); H05K 2201/056 (2013.01); H05K 2201/0909 (2013.01); H05K 2201/09045 (2013.01); H05K 2201/0999 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/09954 (2013.01); H05K 2201/2036 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/0228 (2013.01);
Abstract
A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.