The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jun. 04, 2018
Applicant:
Globalfoundries Inc., Grand Cayman, KY;
Inventors:
Assignee:
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 22/12 (2013.01); H01L 23/3107 (2013.01); H01L 23/585 (2013.01); H01L 22/30 (2013.01); H01L 2224/4903 (2013.01); H01L 2224/94 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A semiconductor device includes a metallization system positioned above a substrate and a die seal positioned at least in the metallization system and delimiting a die region. The die seal includes a via line feature having an axial length and including one or more first portions having a first target dimension and one or more second portions along the axial length. The one or more second portions have a second target dimension less than the first target dimension.