The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Sep. 05, 2018
E Ink Holdings Inc., Hsinchu, TW;
Yu-Chieh Hung, Hsinchu, TW;
Kuan-Yi Lin, Hsinchu, TW;
Chun-Yu Lu, Hsinchu, TW;
Chia-Chun Yeh, Hsinchu, TW;
E Ink Holdings Inc., Hsinchu, TW;
Abstract
A circuit structure includes a flexible substrate, an inorganic barrier layer, a first wire, a second wire, a third wire, a fourth wire, an organic dielectric layer, a first conductive via, and a second conductive via. The inorganic barrier layer is disposed over the flexible substrate. The first and second wires are disposed on the inorganic barrier layer and contact the inorganic barrier layer. The first and second wires are separated from each other. The organic dielectric layer is disposed over the first and second wires. The third wire is disposed in the organic dielectric layer. The fourth wire is disposed above the organic dielectric layer. The first conductive via is disposed in the organic dielectric layer and contacts the first and third wires. The second conductive via is disposed in the organic dielectric layer and contacts the second and fourth wires.