The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jan. 10, 2019
Nanya Technology Corporation, New Taipei, TW;
Hsih-Yang Chiu, Taoyuan, TW;
Nayna Technology Corporation, New Taipei, TW;
Abstract
The present disclosure provides a semiconductor package structure and method for preparing the same. The semiconductor package structure includes a first substrate, a second substrate, an interconnection structure disposed between the first substrate and the second substrate, a plurality of first TSV (through silicon via) conductors penetrating the first substrate and a portion of the interconnect structure, and a plurality of second TSV conductors penetrating the first substrate and a portion of the interconnect structure. The interconnect structure includes a dielectric structure and a plurality of first connecting layers and a plurality of annular second connecting layers disposed within the dielectric structure. At least one of plurality of first TSV conductors is in contact with one of the first connecting layers. At least one of plurality of second TSV conductors is in contact with one of the annular second connecting layers and another one of the first connecting layers.