The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jan. 23, 2018
Eryn Smith, Pleasanton, CA (US);
Eryn Smith, Pleasanton, CA (US);
Other;
Abstract
An automated electrostatic bonding/de-bonding apparatus is used to automate a mating or separating process between a semiconductive wafer and a mobile electrostatic carrier (MESC). The apparatus includes a transfer enclosure, a robot arm, a bonding/de-bonding station, input/output (I/O) ports, I/O cassettes, and a control unit. The I/O cassettes house the different dispensable items that are used during the mating or separating process, such as semiconductive wafers, MESCs, and mated assemblies thereof. The robot arm moves the dispensable items between the I/O cassettes and the bonding/de-bonding station. The transfer enclosure prevents any external physical interference with the movement of the robot arm. The I/O ports integrated into the transfer enclosure allow the robot arm to access the I/O cassettes, which are located outside of the transfer enclosure. The control unit is used to manage the functionalities of the robot arm and the bonding/de-bonding station.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile