The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Mar. 02, 2016
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Osamu Kohno, Echizen, JP;
Yoshihiro Umebayashi, Echizen, JP;
Ryuji Nakamura, Echizen, JP;
Takahiro Hashimoto, Echizen, JP;
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Abstract
When a powder material () is molded by introducing the material into a cavity () between a lower punch () and a die (), compression molding the material between upper and lower punches (and) into a compact () of desired shape, and moving up the lower punch () to eject the compact (), a lubricant is applied to the interior surface of the die () by fitting a pad () around the lower punch () and impregnating the pad with the lubricant. Since the lubricant is applied on every molding operation, molding operation can be continuously carried out.