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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10607747 B1

PDFFull Text
Date of Patent:
Mar. 31, 2020

Filed:

Dec. 02, 2019

Multilayer stack with enhanced conductivity and stability

Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Patrick J. Kinlen, Fenton, MO (US);

Matthew A. Flack, St. Louis, MO (US);

Eric A. Bruton, St. Louis, MO (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:

McDonnell Boehnen Hulbert & Berghoff LLP

Primary Examiner:

Tremesha S Willis

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01B 1/12 (2006.01); H01C 17/065 (2006.01); H01C 17/24 (2006.01); H05B 3/14 (2006.01); H01C 17/26 (2006.01); H01C 7/18 (2006.01); H01C 1/16 (2006.01); H01B 1/22 (2006.01); H01B 1/24 (2006.01); H01B 3/00 (2006.01); H01B 7/02 (2006.01); H01C 7/00 (2006.01); B64D 45/02 (2006.01); H01C 7/02 (2006.01); H01C 17/28 (2006.01); B64D 15/12 (2006.01); H01C 1/142 (2006.01);
U.S. Cl.
CPC ...
H01B 1/127 (2013.01); H01B 1/121 (2013.01); H01B 1/22 (2013.01); H01B 1/24 (2013.01); H01B 3/004 (2013.01); H01B 7/02 (2013.01); H01C 1/16 (2013.01); H01C 7/005 (2013.01); H01C 7/18 (2013.01); H01C 17/06586 (2013.01); H01C 17/24 (2013.01); H01C 17/265 (2013.01); H05B 3/146 (2013.01); B64D 15/12 (2013.01); B64D 45/02 (2013.01); H01C 1/142 (2013.01); H01C 7/028 (2013.01); H01C 17/28 (2013.01); H05B 2214/02 (2013.01);
Abstract

An example method includes: (i) depositing an insulating layer on a substrate; (ii) forming a conductive polymer layer on the insulating layer; and (iii) repeating deposition of a respective insulating layer, and formation of a respective conductive polymer layer to form a multilayer stack of respective conductive polymer layers interposed between respective insulating layers. Each respective conductive polymer layer has a respective electrical resistance, such that when the respective conductive polymer layers are connected in parallel to a power source, a resultant electrical resistance of the respective conductive polymer layers is less than each respective electrical resistance.

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