The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jun. 01, 2017
Hoya Corporation, Tokyo, JP;
Hoya Lamphun Ltd., Amphur Muang, Lamphun, TH;
HOYA CORPORATION, Tokyo, JP;
HOYA LAMPHUN LTD., Lamphun, TH;
Abstract
A magnetic disk substrate having a flat main surface, an end face, and a chamfered face formed between the main surface and the end face. The substrate has an offset portion, present on the main surface within a range of 92.0 to 97.0% in a radial direction from a center of the substrate. A distance from the center of the substrate to the end face of the substrate in a radial direction is 100%, the offset portion being raised or lowered with respect to a virtual straight line connecting two points on the main surface, set at positions of 92.0% and 97.0%. A maximum distance from the virtual straight line to the offset portion in a direction perpendicular to the virtual straight line is a 'maximum offset value.'