IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10607641 B1

PDFFull Text
Date of Patent:
Mar. 31, 2020

Filed:

Sep. 19, 2018

Head gimbal assembly thin-film piezoelectric-material element arranged in step part configuration with protective films

Applicant:

Sae Magnetics (H.k.) Ltd., Hong Kong, HK;

Inventors:

Wei Xiong, Hong Kong, HK;

Atsushi Iijima, Hong Kong, HK;

Assignee:

SAE MAGNETICS (H.K.) LTD., Hong Kong, HK;

Attorney:
Primary Examiner:

Craig A Renner

Int. Cl.
CPC ...
G11B 5/48 (2006.01); H01L 41/053 (2006.01); H01L 41/047 (2006.01); H01L 41/316 (2013.01); H01L 41/29 (2013.01); H01L 41/083 (2006.01); H01L 41/09 (2006.01); H01L 41/08 (2006.01); H01L 41/27 (2013.01); H01L 41/187 (2006.01);
U.S. Cl.
CPC ...
G11B 5/483 (2015.09); H01L 41/0477 (2013.01); H01L 41/0533 (2013.01); H01L 41/083 (2013.01); H01L 41/0815 (2013.01); H01L 41/09 (2013.01); H01L 41/27 (2013.01); H01L 41/29 (2013.01); H01L 41/316 (2013.01); H01L 41/1871 (2013.01); H01L 41/1876 (2013.01);
Abstract

A thin-film piezoelectric-material element includes a laminated structure part having a lower electrode film, a piezoelectric-material film laminated on the lower electrode film and an upper electrode film laminated on the piezoelectric-material film, a lower piezoelectric-material protective-film being formed with alloy material, and an upper piezoelectric-material protective-film being formed with alloy material. The lower piezoelectric-material protective-film and the upper piezoelectric-material protective-film are formed respectively in the lower side of the lower electrode film and the upper side of the upper electrode film, of the laminated structure part, so as to sandwich the laminated structure part.

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