The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Oct. 19, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventor:

Kwang-Jin Lee, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/06 (2006.01); G06F 11/10 (2006.01); G11C 29/52 (2006.01); G11C 29/00 (2006.01); G11C 29/04 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0659 (2013.01); G06F 3/064 (2013.01); G06F 3/0604 (2013.01); G06F 3/0619 (2013.01); G06F 3/0679 (2013.01); G06F 11/1044 (2013.01); G06F 11/1068 (2013.01); G11C 29/52 (2013.01); G11C 29/70 (2013.01); G11C 2029/0411 (2013.01);
Abstract

A nonvolatile memory module including a plurality of memory chips, a spare chip, and a module controller may be provided. The plurality of memory chips may be disposed on a printed circuit board (PCB), and each of the plurality of memory chips may include a plurality of nonvolatile memory cells. The spare chip may be disposed on the PCB and includes a plurality of nonvolatile memory cells. The spare chip may perform different functions according to operation modes of the plurality of memory chips. The module controller may disposed on the PCB, and control operations of the plurality of memory chips and the spare chip.


Find Patent Forward Citations

Loading…