logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10605985 B1

PDFFull Text
Date of Patent:
Mar. 31, 2020

Filed:

Mar. 26, 2018

Integration of bonded optoelectronics, photonics waveguide and vlsi soi

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Russell A. Budd, North Salem, NY (US);

Effendi Leobandung, Stormville, NY (US);

Ning Li, White Plains, NY (US);

Jean-Olivier Plouchart, New York, NY (US);

Devendra K. Sadana, Pleasantville, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Tutunjian & Bitetto, P.C.

Erik Johnson

Primary Examiner:

Chad H Smith

Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/122 (2006.01); G02B 6/42 (2006.01); H01L 31/0216 (2014.01); H01L 31/103 (2006.01); H01L 31/18 (2006.01); G02B 6/132 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); G02B 6/12002 (2013.01); G02B 6/122 (2013.01); G02B 6/132 (2013.01); G02B 6/4201 (2013.01); G02B 6/428 (2013.01); H01L 31/02161 (2013.01); H01L 31/1035 (2013.01); H01L 31/184 (2013.01); H01L 31/1828 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01); G02B 2006/12176 (2013.01);
Abstract

An optoelectronic device includes an integrated circuit including electronic devices formed on a front side of a semiconductor substrate. A barrier layer is formed on a back side of the semiconductor substrate. A photonics layer is formed on the barrier layer. The photonics layer includes a core for transmission of light and a cladding layer encapsulating the core and including a different index of refraction than the core. The core is configured to couple light generated from a component of the optoelectronic device.

Find Patent Forward Citations

Budd, Russell. (2020). Integration of bonded optoelectronics, photonics waveguide and vlsi soi (U.S. Patent No. 10605985). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10605985

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…