The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Jul. 26, 2016
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Kanechika Kiyose, Matsumoto, JP;

Hikaru Iwai, Ina, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); G01S 15/89 (2006.01); A61B 8/00 (2006.01); G01S 7/52 (2006.01);
U.S. Cl.
CPC ...
G01S 15/8915 (2013.01); A61B 8/4281 (2013.01); A61B 8/4444 (2013.01); A61B 8/4494 (2013.01); B06B 1/0629 (2013.01); G01S 7/52077 (2013.01); G01S 7/52079 (2013.01);
Abstract

An ultrasonic device includes an element substrate provided with an ultrasonic transducer array having a plurality of ultrasonic transducers arranged in an array, and having a first surface and a second surface located on an opposite side to the first surface, a terminal part disposed on the first surface of the element substrate, and outside the ultrasonic transducer array in a planar view viewed from a normal direction of the first surface, and electrically connected to the ultrasonic transducers, and a reinforcing plate disposed on the second surface of the element substrate in an area overlapping the terminal part in the planar view, and higher in bending rigidity than the element substrate.


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