The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Sep. 05, 2017
Applicant:

Fluke Corporation, Everett, WA (US);

Inventors:

David L. Epperson, Spokane, WA (US);

Ronald Steuer, Hinterbruhl, AT;

Jeffrey Worones, Seattle, WA (US);

Patrick Scott Hunter, Seattle, WA (US);

Ricardo Rodriguez, Mill Creek, WA (US);

Assignee:

Fluke Corporation, Everett, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 15/16 (2006.01); G01R 19/28 (2006.01); G01R 19/165 (2006.01); G01R 15/20 (2006.01); G01R 1/22 (2006.01); G01R 15/14 (2006.01); G01R 19/00 (2006.01);
U.S. Cl.
CPC ...
G01R 15/16 (2013.01); G01R 1/22 (2013.01); G01R 15/14 (2013.01); G01R 15/142 (2013.01); G01R 15/20 (2013.01); G01R 19/00 (2013.01); G01R 19/165 (2013.01); G01R 19/28 (2013.01);
Abstract

Systems and methods for measuring alternating current (AC) voltage of an insulated conductor are provided, without requiring a galvanic connection between the conductor and a test electrode. A non-galvanic contact voltage measurement device includes a conductive sensor, an internal ground guard, and a reference shield. A reference voltage source is electrically coupleable between the guard and the reference shield to generate an AC reference voltage which causes a reference current to pass through the conductive sensor. Sensor subsystems may be arranged in layers (e.g., stacked layers, nested layers, or components) of conductors and insulators. The sensor subsystems may be packaged as formed sheets, flexible circuits, integrated circuit (IC) chips, nested components, printed circuit boards (PCBs), etc. The sensor subsystems may be electrically coupled to suitable processing or control circuitry of a non-contact voltage measurement device to allow for measurement of voltages in insulated conductors.


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