The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Mar. 18, 2016
Applicant:
Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;
Inventors:
Shuntaro Machida, Tokyo, JP;
Nobuyuki Sugii, Tokyo, JP;
Keiji Watanabe, Tokyo, JP;
Daisuke Ryuzaki, Tokyo, JP;
Tetsufumi Kawamura, Tokyo, JP;
Kazuki Watanabe, Tokyo, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 15/08 (2006.01); B81C 99/00 (2010.01); G01P 15/125 (2006.01);
U.S. Cl.
CPC ...
G01P 15/0802 (2013.01); B81C 99/001 (2013.01); B81C 99/0025 (2013.01); B81C 99/0065 (2013.01); B81C 2201/0143 (2013.01); B81C 2201/0181 (2013.01); B81C 2203/038 (2013.01); G01P 15/125 (2013.01);
Abstract
For the purpose of shortening the MEMS manufacturing TAT, the MEMS manufacturing method according to the present invention includes a step of extracting the first MEMS with first characteristic in a range approximate to the required characteristic from the plurality of MEMS preliminarily prepared on the main surface of the substrate, and a step of forming a second MEMS having the required characteristic by directly processing the first MEMS.