The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Oct. 25, 2017
Applicant:
Honeywell International Inc., Morris Plains, NJ (US);
Inventors:
Assignee:
Honeywell International Inc., Morris Plains, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2006.01); F16F 15/02 (2006.01); G01D 11/10 (2006.01); B81B 7/00 (2006.01); G01D 11/24 (2006.01); G01P 1/00 (2006.01); F16F 15/08 (2006.01); G01C 21/16 (2006.01); H05K 7/14 (2006.01); H05K 7/20 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
G01P 1/023 (2013.01); B81B 7/0016 (2013.01); F16F 15/022 (2013.01); F16F 15/08 (2013.01); G01C 21/16 (2013.01); G01D 11/10 (2013.01); G01D 11/245 (2013.01); G01P 1/003 (2013.01); H05K 5/0078 (2013.01); H05K 7/142 (2013.01); H05K 7/2049 (2013.01);
Abstract
A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.