The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Jun. 07, 2017
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Joseph Iannotti, Glenville, NY (US);

Christopher James Kapusta, Delanson, NY (US);

David Richard Esler, Gloversville, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01N 29/22 (2006.01); G01K 11/26 (2006.01); B23K 1/002 (2006.01); G01L 1/16 (2006.01); G01L 3/00 (2006.01); G01N 29/24 (2006.01); G01L 19/14 (2006.01);
U.S. Cl.
CPC ...
G01N 29/223 (2013.01); B23K 1/002 (2013.01); G01K 11/265 (2013.01); G01L 1/165 (2013.01); G01L 3/00 (2013.01); G01L 19/147 (2013.01); G01N 29/2462 (2013.01);
Abstract

A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.


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