The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Mar. 06, 2014
Usa As Represented BY the Administrator of the National Aeronautics & Space Administration (Nasa), Washington, DC (US);
Margaret M. Stackpoole, Santa Clara, CA (US);
Jay D. Feldman, Sunnyvale, CA (US);
Donald T. Ellerby, Santa Clara, CA (US);
Ethiraj Venkatapathy, Los Altos, CA (US);
Curt G. Wilkinson, Fleetwood, PA (US);
United States of America as Represented by the Administrator of NASA, Washington, DC (US);
Abstract
A thermal protection system (TPS) for a space vehicle that undergoes partial or full ablation when the TPS is exposed to severe heating during entry into a planetary atmosphere. A first layer includes at least one of carbon, phenolic, silica, alumina and another oxide, low thermal conductivity fibers and yarns connecting two or more first layer sub-layers, is recession-resistant and has reduced porosity. A second layer has a smaller fiber fraction, reduced thermal conductivity and reduced density, and serves as a thermal insulator. The first layer may have partial or full insertion of a resin, or may have a surface densified, recession-resistant sub-layer. Values of a first subset of as many as eight environmental parameters can be used to characterize the space vehicle mission. A second subset of TPS parameters for the system is evaluated to identify whether an ablator system with these TPS values can survive the conditions associated with the first subset of environmental parameters.