The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Feb. 05, 2018
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Kensuke Katagiri, Ashigarakami-gun, JP;

Shin Tajiri, Ashigarakami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); C09D 113/02 (2006.01); H01B 1/22 (2006.01); G03C 1/04 (2006.01); C08K 3/08 (2006.01); B32B 27/18 (2006.01); G03F 7/40 (2006.01); C08J 7/04 (2020.01); H01B 5/14 (2006.01); C08J 3/24 (2006.01); C09D 5/24 (2006.01); C09D 189/06 (2006.01); G03F 7/06 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G06F 3/044 (2006.01); H01B 13/00 (2006.01); H03K 17/96 (2006.01); C08L 39/04 (2006.01); C08L 33/02 (2006.01);
U.S. Cl.
CPC ...
C09D 113/02 (2013.01); B32B 27/18 (2013.01); C08J 3/24 (2013.01); C08J 7/042 (2013.01); C08J 7/047 (2013.01); C08K 3/08 (2013.01); C09D 5/24 (2013.01); C09D 189/06 (2013.01); G03C 1/04 (2013.01); G03F 7/06 (2013.01); G03F 7/16 (2013.01); G03F 7/2002 (2013.01); G03F 7/327 (2013.01); G03F 7/40 (2013.01); G06F 3/041 (2013.01); G06F 3/044 (2013.01); H01B 1/22 (2013.01); H01B 5/14 (2013.01); H01B 13/0036 (2013.01); H03K 17/962 (2013.01); C08J 2313/02 (2013.01); C08J 2367/02 (2013.01); C08J 2389/06 (2013.01); C08J 2413/02 (2013.01); C08J 2433/00 (2013.01); C08J 2433/10 (2013.01); C08J 2489/06 (2013.01); C08K 2003/0806 (2013.01); C08K 2201/001 (2013.01); C08L 33/02 (2013.01); C08L 39/04 (2013.01); G06F 2203/04103 (2013.01);
Abstract

A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.


Find Patent Forward Citations

Loading…