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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10604654 B1

PDFFull Text
Date of Patent:
Mar. 31, 2020

Filed:

Apr. 12, 2018

Curable resin composition

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Takayuki Kusunoki, Annaka, JP;

Yuusuke Takamizawa, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Marc S Zimmer

Int. Cl.
CPC ...
C08L 83/14 (2006.01); H01L 33/56 (2010.01); C08G 77/52 (2006.01); C08K 5/54 (2006.01); H01L 23/29 (2006.01); H01L 33/50 (2010.01); C08G 77/00 (2006.01); C08G 77/60 (2006.01); C07F 7/08 (2006.01);
U.S. Cl.
CPC ...
C08L 83/14 (2013.01); C08G 77/52 (2013.01); C08K 5/5403 (2013.01); H01L 23/296 (2013.01); H01L 33/56 (2013.01); C07F 7/0805 (2013.01); C08G 77/60 (2013.01); C08G 77/80 (2013.01); H01L 33/507 (2013.01);
Abstract

One of the purposes of the present invention is to provide a curable resin composition which has good curability and provides a cured product having a sufficient hardness, in particular an addition-curable organic silicon resin composition. The present invention provides a curable resin composition comprising the following components (A) to (C): (A) an organic-silicon compound having at least two alkenyl groups in a molecule, (B) an organic silicon compound which is represented by the formula (I) and has at least three hydrosilyl groups each bonded to the carbon atom of the benzene ring in an amount such that a ratio of the number of the hydrosilyl group in component (B) to the number of the alkenyl group in component (A) is 0.4 to 4,

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