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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10604641 B1

PDFFull Text
Date of Patent:
Mar. 31, 2020

Filed:

Oct. 03, 2016

Thermosetting resin composition and prepreg and laminate both made with the same

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Shinji Tsuchikawa, Ibaraki, JP;

Masanori Akiyama, Ibaraki, JP;

Tomohiko Kotake, Ibaraki, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, L.L.P.

Primary Examiner:

Monique R Jackson

Int. Cl.
CPC ...
C08K 5/5333 (2006.01); C08L 63/00 (2006.01); B32B 15/092 (2006.01); C08K 3/36 (2006.01); B32B 15/20 (2006.01); C08J 5/24 (2006.01); C08K 3/32 (2006.01); C08G 59/56 (2006.01); B32B 5/02 (2006.01); C08K 3/22 (2006.01); C08L 63/04 (2006.01); C09J 163/00 (2006.01); C09J 163/04 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08K 5/5333 (2013.01); B32B 5/02 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); C08G 59/56 (2013.01); C08J 5/24 (2013.01); C08K 3/22 (2013.01); C08K 3/32 (2013.01); C08K 3/36 (2013.01); C08L 63/00 (2013.01); C08L 63/04 (2013.01); C09J 163/00 (2013.01); C09J 163/04 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2363/04 (2013.01); C08K 2003/2227 (2013.01); C08L 2201/02 (2013.01); C09J 2205/102 (2013.01); H05K 1/0353 (2013.01); Y10T 428/31678 (2015.04);
Abstract

The present invention provides a thermosetting resin composition comprising (A) a metal salt of disubstituted phosphinic acid, (B) a maleimide compound having a N-substituted maleimide group in a molecule, (C) a 6-substituted guanamine compound or dicyandiamide and (D) an epoxy resin having at least two epoxy groups in a molecule and a prepreg and a laminated plate which are prepared by using the same. The prepregs obtained by impregnating or coating a base material with the thermosetting resin compositions of the present invention and the laminated plates produced by laminating and molding the above prepregs are balanced in all of a copper foil adhesive property, a glass transition temperature, a solder heat resistance, a moisture absorption, a flame resistance, a relative dielectric constant and a dielectric loss tangent, and they are useful as a printed wiring board for electronic instruments.

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