The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Oct. 27, 2016
Daelim Industrial Co., Ltd., Seoul, KR;
Seung Tack Yu, Gyeonggi-do, KR;
Byung Keel Sohn, Daejeon, KR;
Yong Jae Jun, Daejeon, KR;
Young Shin Jo, Daejeon, KR;
Ki Soon Park, Daejeon, KR;
Jin Sook Oh, Daejeon, KR;
Sang Won Yu, Daejeon, KR;
Man Jung Kim, Daejeon, KR;
Dug Hoon Sung, Daejeon, KR;
Hee Suk Kim, Daejeon, KR;
Hae Guen Jeong, Daejeon, KR;
DAELIM INDUSTRIAL CO., LTD., Seoul, KR;
Abstract
Multimodal polyolefin resins for manufacturing films, pipes, hollow molded articles having high melt strength and excellent formability, mechanical strength, processability and appearance are described. The resins have: density is 0.930-0.960 g/cm; melt flow index is 0.01-10.0 g/10 minutes; ratio Mw/Mn is 10-60; and two or more peaks appear when molecular weight is measured by GPC. In molded pipe, the Mw of polymer collected at position B is 0.1% greater than Mw of polymer collected at position A; polymer having Mw of 10,000 or less among polymers collected at position A is 0.1% greater than the amount of polymer having Mw of 10,000 or less among polymers collected at position B; and the amount of polymer having Mw of 1,000,000 or more among polymers collected at position B is 0.1% greater than the amount of polymer having Mw of 1,000,000 or more among polymers collected at position A.