The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Nov. 13, 2018
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Masashi Fujioka, Minowa-machi, JP;
Eiju Hirai, Azumino, JP;
Isao Yanagisawa, Chino, JP;
Ikuya Miyazawa, Yamagata-mura, JP;
Assignee:
Seiko Epson Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); H01L 23/00 (2006.01); H01L 41/047 (2006.01); H01L 41/09 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14233 (2013.01); H01L 24/14 (2013.01); H01L 41/0475 (2013.01); H01L 41/0973 (2013.01); B41J 2/14201 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/18 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01);
Abstract
In an MEMS device, in a Z direction that is a direction in which a first core portion, a plurality of first bump wiring, and a plurality of first individual wiring are laminated, a width between the first core portion and a wiring substrate is wider than a maximum particle diameter of solid particles contained in an adhesive, and a width between a first wiring and a second wiring and a width between a third wiring and a fourth wiring are wider than the maximum particle diameter of the solid particles.