The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Oct. 12, 2015
Applicant:
Hewlett-packard Development Company, L.p., Houston, TX (US);
Inventors:
Chien-Hua Chen, Corvallis, OR (US);
Michael W. Cumbie, Albany, OR (US);
Silam J. Choy, Corvallis, OR (US);
Assignee:
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/14 (2006.01); B41J 2/16 (2006.01); B41J 2/155 (2006.01);
U.S. Cl.
CPC ...
B41J 2/14072 (2013.01); B41J 2/155 (2013.01); B41J 2/1603 (2013.01); B41J 2/1626 (2013.01); B41J 2/1628 (2013.01); B41J 2/1629 (2013.01); B41J 2/1632 (2013.01); B41J 2/1634 (2013.01); B41J 2/1635 (2013.01); B41J 2/1637 (2013.01); B41J 2202/20 (2013.01);
Abstract
A printhead includes a moldable substrate, and a number of printhead dies molded into the moldable substrate. The printhead dies include a number of printhead dies molded into the moldable substrate. The dies comprise a non-rectangular shape. A number of fluid slots are defined in the moldable substrate to fluidically coupled to the printhead dies to feed fluid to the printhead dies. The number of fluid slots is not equal to the number of printhead dies.