The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Aug. 27, 2018
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Motonori Chikamoto, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/045 (2006.01); H01L 41/04 (2006.01); B41J 2/14 (2006.01); H01L 41/053 (2006.01); B41J 2/16 (2006.01);
U.S. Cl.
CPC ...
B41J 2/04541 (2013.01); B41J 2/04581 (2013.01); B41J 2/04588 (2013.01); B41J 2/04593 (2013.01); B41J 2/04596 (2013.01); B41J 2/14201 (2013.01); B41J 2/14233 (2013.01); B41J 2/161 (2013.01); B41J 2/1623 (2013.01); H01L 41/042 (2013.01); H01L 41/053 (2013.01); B41J 2002/14241 (2013.01); B41J 2002/14362 (2013.01); B41J 2002/14419 (2013.01); B41J 2002/14491 (2013.01); B41J 2202/18 (2013.01);
Abstract

A print head includes an ejection unit that ejects liquid when a piezoelectric element is driven; a driving IC that includes a circuit element and wiring, and that controls driving of the ejection unit; a relay substrate that transfers a signal for controlling driving of the piezoelectric element; that is physically coupled to the driving IC and the relay substrate, and that electrically couples the driving IC and the relay substrate to each other by using an electrode arranged on a surface of a resin; and that is physically coupled to the driving IC and the relay substrate, and that does not electrically couple the driving IC and the relay substrate to each other by using an electrode arranged on a surface of a resin, wherein the energization bump overlap the circuit element or the wiring, and the inspection bump not overlap the circuit element and the wiring.


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