The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Sep. 30, 2015
Safran Aircraft Engines, Paris, FR;
Marc-Emmanuel Techer, Moissy-cramayel, FR;
Raoul Jaussaud, Moissy-cramayel, FR;
Safran Aircraft Engines, Paris, FR;
Abstract
A method of molding a thermosetting resin, in particular of the epoxy resin type, in which a first mold is filled with the resin while causing the temperature of the resin to vary in application of a first temperature program, without exceeding the Tg of the resin. After the first mold has been filled, the resin is put under pressure while causing the temperature of the resin to vary in application of a second temperature program, without exceeding Tg, and a drop in the pressure exerted by the resin on the mold is detected with the instant at which this pressure presents a break of slope being identified as the instant t1. A second mold is filled with the thermosetting resin in application of the first temperature program. After the second mold has been filled, the resin is put under pressure in application of the second temperature program until an instant t2 close to t1. As from t2, the temperature of the resin is increased to exceed Tg.