The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Aug. 19, 2015
Applicant:
Evapco, Inc., Taneytown, MD (US);
Inventors:
Davey Vadder, Manchester, MD (US);
Jeff Kane, Biglerville, PA (US);
Assignee:
Evapco, Inc., Taneytown, MD (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); B32B 7/00 (2019.01); B32B 27/00 (2006.01); B29C 65/00 (2006.01); B32B 27/06 (2006.01); B32B 3/28 (2006.01); B32B 27/30 (2006.01); B32B 7/05 (2019.01); B29C 65/18 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 66/87 (2013.01); B29C 65/18 (2013.01); B29C 66/43 (2013.01); B29C 66/81422 (2013.01); B32B 3/28 (2013.01); B32B 7/05 (2019.01); B32B 27/06 (2013.01); B32B 27/304 (2013.01); B29K 2105/256 (2013.01);
Abstract
A Thermal Bonding Method and Apparatus to thermally bond sheets of fill in a cooling tower fill pack. The apparatus creates a hemispherical joint extending through two fill sheets to provide a substantial joint between said sheets.