The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Nov. 20, 2016
Apparatus for the material-bonded connection of connection partners of a power-electronics component
Semikron Elektronik Gmbh & Co., KG, Nürnberg, DE;
Ingo Bogen, Nürnberg, DE;
Heiko Braml, Wiesenttal, DE;
Christian Göbl, Nürnberg, DE;
Ulrich Sagebaum, Feucht, DE;
Jürgen Windischmann, Pommersfelden, DE;
Semikron Elektronik GmbH & Co., KG, Nürnberg, DE;
Abstract
A pressing ram having an elastic cushion element and intended for the material-bonded press-sintering connection of a first connection partner to a second connection partner of a power-electronics component. The elastic cushion element of the pressing ram is enclosed by a dimensionally stable frame, within which the cushion element and a guide part of the pressing ram are guided for linear movement such that the dimensionally stable frame lowers onto the first connection partner, or a workpiece carrier with the first connection partner arranged therein, and, following abutment against the same, the pressing ram together with the elastic cushion element is lowered onto the second connection partner and the elastic cushion exerts a pressure necessary for connecting the first connection partner to the second connection partner.