The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Apr. 21, 2015
Applicant:

Hitachi, Ltd., Tokyo, JP;

Inventors:

Shuntaro Machida, Tokyo, JP;

Daisuke Ryuzaki, Tokyo, JP;

Tatsuya Nagata, Tokyo, JP;

Naoaki Yamashita, Tokyo, JP;

Yuko Hanaoka, Tokyo, JP;

Yasuhiro Yoshimura, Tokyo, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B06B 1/06 (2006.01); G01N 29/24 (2006.01); G01N 29/04 (2006.01); B06B 1/02 (2006.01); H04R 31/00 (2006.01); H04R 19/00 (2006.01); A61B 8/00 (2006.01);
U.S. Cl.
CPC ...
B06B 1/06 (2013.01); B06B 1/0292 (2013.01); B06B 1/0607 (2013.01); B06B 1/0644 (2013.01); G01N 29/043 (2013.01); G01N 29/24 (2013.01); G01N 29/2406 (2013.01); A61B 8/4461 (2013.01); A61B 8/4494 (2013.01); G01N 2291/0232 (2013.01); G01N 2291/106 (2013.01); H04R 19/005 (2013.01); H04R 31/00 (2013.01);
Abstract

A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.


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