The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Aug. 09, 2016
Applicant:

Schweizer Electronic Ag, Schramberg, DE;

Inventors:

Thomas Gottwald, Dunningen, DE;

Christian Rössle, St. Georgen, DE;

Christian Dold, Schönwald, DE;

Dirk Gennermann, Dormagen, DE;

Assignee:

SCHWEIZER ELECTRONIC AG, Schramberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0243 (2013.01); H01Q 9/0407 (2013.01); H05K 1/185 (2013.01); H05K 3/462 (2013.01); H05K 3/4617 (2013.01); H05K 3/4694 (2013.01); H05K 3/4697 (2013.01); H05K 2201/015 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09127 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/063 (2013.01);
Abstract

A method for producing a radio-frequency antenna in a conductor structural element with an encompassing layer sequence, including: providing a rigid carrier having an underside and a top side; defining an antenna assignment section on the rigid carrier; applying at least one electrically insulating layer with a recess in such a way that the antenna assignment section is exposed; placing a radio-frequency substrate above the antenna assignment section with formation of a cavity between the rigid carrier and the radio-frequency substrate; aligning and fixing the radio-frequency substrate relative to the rigid carrier; laminating the layer construction prepared in this manner such that resin material of the at least one electrically insulating layer liquefies and encloses the radio-frequency substrate with the cavity being left free; cutting the antenna assignment section out of the rigid carrier from the outer underside (remote from the layer construction) of the rigid carrier.


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