The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Jun. 04, 2015
Applicant:

Huawei Technologies Co., Ltd., Shenzhen, CN;

Inventors:

Zhiguo Zhang, Wuhan, CN;

Yingchun Zhang, Shenzhen, CN;

Haitao Zhen, Wuhan, CN;

Nanbo Kang, Shenzhen, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 9/00 (2006.01); H05K 5/02 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H05K 5/0086 (2013.01); H05K 5/02 (2013.01); H05K 9/0024 (2013.01);
Abstract

A mobile terminal includes a circuit board, a heat emitting element disposed on the circuit board, a shielding can, and a middle frame, where the shielding can is connected to the circuit board, and forms a shielding space together with the circuit board; the heat emitting element is accommodated in the shielding space; the circuit board is disposed on one side of the middle frame; the middle frame is provided with an accommodating space; and the shielding can includes a top and a bottom that are disposed opposite to each other, where the bottom is configured to be connected to the circuit board, and the top is located above the heat emitting element and extends to the accommodating space. The present disclosure further provides a heat dissipation and shielding structure. The present disclosure helps make a mobile terminal and a heat dissipation and shielding structure lighter and thinner.


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