The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Sep. 19, 2016
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Ravi Kiran Nalla, San Jose, CA (US);

Raymond Kirk Price, Redmond, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2254 (2013.01); H04N 5/2253 (2013.01); H04N 5/2257 (2013.01); H05K 1/0206 (2013.01); H05K 3/4697 (2013.01); H05K 1/183 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01);
Abstract

This document describes techniques and apparatuses that implement an ultra-compact image sensor assembly. In some embodiments, a printed circuit board assembly comprises a multilayer printed circuit board (PCB) having an asymmetric core structure. A cavity extends from an exterior layer of the multilayer PCB to an exposed portion of an interior layer of the multilayer PCB. The interior layer can be formed on the asymmetric core structure or another PCB layer above the asymmetric core structure. An image sensor is mounted at least partially in the cavity and electrically connected to conductive pads embodied on the exposed portion of the interior layer of the multilayer PCB. By mounting the image sensor in the cavity, height and planar dimensions of the image sensor assembly can be reduced, thereby enabling thinner profile imaging devices.


Find Patent Forward Citations

Nalla, Ravi. (2020). Ultra-compact image sensor assembly for thin profile devices (U.S. Patent No. 10602039). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10602039

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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