The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Dec. 05, 2018
Applicant:

Lotes Co., Ltd, Keelung, TW;

Inventors:

Ted Ju, Keelung, TW;

Zhi Yong Zhou, Keelung, TW;

Zuo Feng Jin, Keelung, TW;

Assignee:

LOTES CO., LTD, Keelung, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H01R 13/24 (2006.01); H01R 12/55 (2011.01); H01R 12/52 (2011.01); H01R 12/70 (2011.01); H01R 13/40 (2006.01); H01R 13/502 (2006.01); H01R 13/514 (2006.01); H01R 12/71 (2011.01); H01R 12/57 (2011.01); H01R 13/41 (2006.01);
U.S. Cl.
CPC ...
H01R 13/2464 (2013.01); H01R 12/52 (2013.01); H01R 12/55 (2013.01); H01R 12/57 (2013.01); H01R 12/7076 (2013.01); H01R 12/714 (2013.01); H01R 13/40 (2013.01); H01R 13/41 (2013.01); H01R 13/502 (2013.01); H01R 13/514 (2013.01);
Abstract

An electrical connector for electrically connecting a chip module to a circuit board includes a body for upwardly bearing the chip module. The body is provided with multiple accommodating holes. Each accommodating hole has a first groove and a second groove, and a width of the second groove is less than a width of the first groove. Multiple terminals are correspondingly accommodated in the accommodating holes. Each terminal includes: a base, accommodated in the first groove; an extending portion, bending and extending from one side of the base and accommodated in the second groove; a conducting portion, provided on a bottom portion of the terminal to be electrically connected with the circuit board; and an elastic portion, formed by upwardly bending and extending from the extending portion to abut the chip module.


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