The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10601149 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 24, 2020

Filed:

Aug. 15, 2014
Applicants:

Agc Automotive Americas R&d, Inc., Ypsilanti, MI (US);

Agc Flat Glass North America, Inc., Alpharetta, GA (US);

Inventors:

Daniel D. Bennett, Tecumseh, MI (US);

William C. Schuch, Adrian, MI (US);

Assignee:

AGC Automotive Americas R&D, Inc., Ypsilanti, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 4/28 (2006.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05B 3/86 (2006.01); B23K 1/00 (2006.01); B23K 1/19 (2006.01); H01R 4/02 (2006.01); H01R 13/24 (2006.01); H05B 3/84 (2006.01); H05K 1/03 (2006.01); H05K 3/34 (2006.01); H05B 1/02 (2006.01);
U.S. Cl.
CPC ...
H01R 4/28 (2013.01); B23K 1/0008 (2013.01); B23K 1/19 (2013.01); H01R 4/02 (2013.01); H01R 13/2414 (2013.01); H05B 1/0236 (2013.01); H05B 3/84 (2013.01); H05B 3/86 (2013.01); H05K 1/0212 (2013.01); H05K 3/40 (2013.01); H01R 2201/26 (2013.01); H05B 2203/016 (2013.01); H05K 1/0306 (2013.01); H05K 3/3421 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10977 (2013.01);
Abstract

A window assembly () includes a transparent pane (), an electrical conductor () contacting the transparent pane (), an electrical connection element () for energizing the electrical conductor (), an electrically conductive solder joint () disposed between the electrical connection element () and the electrical conductor () for providing an electrical connection between the electrical connection element () and the electrical conductor (), an encapsulation () over the electrical connection element () and the electrical conductor (), and a casing () disposed between the encapsulation () and the electrical conductor () to prevent contact between the encapsulation () and the solder joint ().


Find Patent Forward Citations

Bennett, Daniel. (2020). Window assembly with casing for solder joint (U.S. Patent No. 10601149). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10601149

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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