The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Oct. 12, 2017
Sumitomo Wiring Systems, Ltd., Mie, JP;
Tatsuo Tamagawa, Mie, JP;
Masamichi Yamagiwa, Mie, JP;
Takuya Suzuki, Mie, JP;
Daichi Miura, Mie, JP;
SUMITOMO WIRING SYSTEMS, LTD., Mie, JP;
Abstract
The present invention enables a core wire that contains a plurality of strands and a bonding object to be bonded more reliably using an ultrasonic bonding device that cantilever supports a pressing portion that performs ultrasonic bonding. A bonding object (for example, a terminal) is supported as on a stage, a core wire is overlaid on the bonding object, and the core wire and the bonding object are ultrasonically bonded in a state where the core wire is pressed toward the bonding object, using a pressing portion that is supported in cantilever fashion. During ultrasonic bonding, a pressing surface of the pressing portion is inclined in a pressing direction progressively toward a side where the pressing portion is cantilever supported, and also a bonding surface of the bonding object is inclined in the pressing direction progressively toward the side where the pressing portion is cantilever supported.