The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Feb. 25, 2016
Applicant:

Nippon Electric Glass Co., Ltd., Shiga, JP;

Inventor:

Toru Shiragami, Shiga, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 41/23 (2013.01); H01L 23/10 (2006.01); H01L 23/02 (2006.01); H01L 23/08 (2006.01); B32B 18/00 (2006.01); H01L 41/053 (2006.01); H03H 3/02 (2006.01); C04B 37/04 (2006.01);
U.S. Cl.
CPC ...
H01L 41/23 (2013.01); B32B 18/00 (2013.01); C04B 37/045 (2013.01); H01L 23/02 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 41/053 (2013.01); C04B 2235/5436 (2013.01); C04B 2235/5463 (2013.01); C04B 2235/963 (2013.01); C04B 2235/9607 (2013.01); C04B 2237/10 (2013.01); C04B 2237/32 (2013.01); C04B 2237/343 (2013.01); C04B 2237/52 (2013.01); C04B 2237/592 (2013.01); C04B 2237/708 (2013.01); H03H 3/02 (2013.01);
Abstract

A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.


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