The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Jul. 13, 2018
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Chang Man Lim, Seoul, KR;

Ki Seok Kim, Seoul, KR;

Young Shin Kim, Seoul, KR;

June O Song, Seoul, KR;

Ju Hyeon Oh, Seoul, KR;

Chang Hyeong Lee, Seoul, KR;

Tae Sung Lee, Seoul, KR;

Se Yeon Jung, Seoul, KR;

Byung Yeon Choi, Seoul, KR;

Sung Min Hwang, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/38 (2010.01); H01L 33/44 (2010.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/382 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

The light emitting device package disclosed in the embodiment includes: first and second frames having first and second through holes; a body disposed between the first and second frames; a light emitting device including a first bonding pad and a second bonding pad; and a conductive part in the first and second through holes. wherein at least one of the first and second bonding pads faces the first and second frames and overlaps with the first and second through holes and includes a contact region contacting the conductive part and a first non-contact non-contacting the conducive part.


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