The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
May. 13, 2016
Mitsubishi Electric Corporation, Tokyo, JP;
Mituharu Tabata, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A technique disclosed in the specification relates to a semiconductor device capable of minimizing restrictions on wire bonding activities and to a method for producing the semiconductor device. The semiconductor device of the present technique includes: a plurality of semiconductor chips disposed on a circuit pattern within a case defined by an outer frame in a plan view; and bonding wires for electrically connecting the semiconductor chips and the circuit pattern together. The semiconductor chips are arranged along a longer-side direction of the case. The bonding wires are strung along the longer-side direction of the case.