The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Feb. 28, 2017
Kaijo Corporation, Tokyo, JP;
Hideki Yoshino, Tokyo, JP;
Masaaki Miura, Tokyo, JP;
KAIJO CORPORATION, Tokyo, JP;
Abstract
There is provided a bonding method capable of accurately positioning a bonding stage. According to an aspect of the present invention, a bonding method using a bonding apparatus including a rotation drive mechanism for rotating a bonding stageabout a θ-axis includes the steps of: (e) locking the bonding stage with respect to the θ-axis, and bonding a wire or bump onto a certain area of a substrate held on the bonding stage; (f) unlocking the bonding stage with respect to the θ-axis, and rotating the bonding stage about the θ-axis with the rotation drive mechanism; and (g) locking the bonding stage with respect to the θ-axis, and bonding a wire or bump onto a remaining region of the substrate.