The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Feb. 13, 2019
Applicant:
Infineon Technologies Austria Ag, Villach, AT;
Inventors:
Andreas Moser, Maria-Rain, AT;
Hans Weber, Bayerisch Gmain, DE;
Johannes Baumgartl, Riegersdorf, AT;
Gabor Mezoesi, Villach, AT;
Michael Treu, Villach, AT;
Assignee:
Infineon Technologies Austria AG, Villach, AT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); G03F 9/00 (2006.01); H01L 21/266 (2006.01); H01L 21/308 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G03F 9/7076 (2013.01); H01L 21/266 (2013.01); H01L 21/308 (2013.01); H01L 29/0634 (2013.01); H01L 2223/5442 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01);
Abstract
An alignment mark in a process surface of a semiconductor layer includes a groove with a minimum width of at least 100 μm and a vertical extension in a range 100 nm to 1 μm. The alignment mark further includes at least one fin within the groove at a distance of at least 60 μm to a closest one of inner corners of the groove.