The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Aug. 09, 2018
Applicant:
Hrl Laboratories, Llc, Malibu, CA (US);
Inventors:
Florian G. Herrault, Agoura Hills, CA (US);
Zak C. Eckel, Thousand Oaks, CA (US);
Tobias A. Schaedler, Oak Park, CA (US);
Robert Mone, Boston, MA (US);
Assignee:
HRL Laboratories, LLC, Malibu, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 23/15 (2006.01); H01L 23/50 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); B29C 64/10 (2017.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); B29C 64/10 (2017.08); H01L 21/486 (2013.01); H01L 23/15 (2013.01); H01L 23/49816 (2013.01); H01L 23/50 (2013.01); H01L 24/17 (2013.01); H05K 1/0306 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15331 (2013.01);
Abstract
An interposer includes an interposer substrate having a series of vias, and a series of metallic interconnects in the series of vias. The interposer substrate has a first surface and a second surface opposite the first surface. The interposer substrate includes a dielectric material. A first pitch of the series of vias at a first end of the series of vias is different than a second pitch of the series of vias at a second end of the series of vias.