The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

May. 10, 2016
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Chia-Yu Chang, Taipei Hsien, TW;

Chih-Chien Ho, Taipei Hsien, TW;

Steven Su, Tainan, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); G06F 17/50 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49503 (2013.01); G06F 17/5077 (2013.01); H01L 23/49541 (2013.01); H01L 23/49548 (2013.01); H01L 23/49551 (2013.01); H01L 24/00 (2013.01); H01L 23/3107 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06582 (2013.01); H01L 2225/06593 (2013.01); H01L 2924/181 (2013.01);
Abstract

A leadframe includes a first die attach pad ('DAP') having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.


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