The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Dec. 13, 2017
Applicant:

Dana Canada Corporation, Oakville, CA;

Inventors:

Meinrad K. A. Machler, Oakville, CA;

Colin A. Shore, Hamilton, CA;

Dale L. Bartnik, Mississauga, CA;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); F28D 1/03 (2006.01); F28F 3/12 (2006.01); H01L 25/11 (2006.01); H01L 25/07 (2006.01); F28F 13/00 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H05K 7/20 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); F28D 1/0325 (2013.01); F28F 3/12 (2013.01); F28F 13/00 (2013.01); H01L 23/40 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/11 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01); F28D 2021/0029 (2013.01); F28F 2275/08 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4081 (2013.01); H01L 2023/4087 (2013.01);
Abstract

A heat exchanger assembly has first and second heat sink elements enclosing fluid flow passages, and a clamping assembly. The heat sink elements are separated by a space in which at least one heat-generating electronic component is located, with outer side surfaces of each electronic component being in thermal contact with the heat sink elements. The clamping assembly has first and second spring elements arranged in contact with an outer surfaces of the heat sink elements. The spring elements are joined together to apply compressive forces to the heat sink elements and to cause the electronic components to be clamped between the heat sink elements. Each spring element has discrete force application regions for applying force to a heat sink element, and a plurality of fastening regions for compressing and maintaining the positions of the spring elements relative to the outer surfaces of the heat sink elements.


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